The client was looking for solutions to increase I/O contact points and develop its microelectronic modules via the addition of new functions while reducing footprint.
A solution has been tested and retained via the use of a multilayered ceramic substrate allowing for the 3D integration of components and a high number of contacts.
This R&D project took time to bring about and ABAC international stayed close to the client over its entire development period. ABAC accompanied the client to MSE or MSE engineers to the client and helped create a trusted relationship.
This solution will be used by the client for other versions of its product.